Wireless Ecosystem

Wireless technologies like Wi-Fi® for wireless local area networks (WLAN), BLUETOOTH® technology for content streaming, and Bluetooth low energy technology for ultra-low-power connectivity form the backbone of IoT. Infineon Technologies seamlessly integrates all these technologies to provide state-of-the-art, interoperable solutions for consumer, industrial, medical, automotive, and other applications. Infineon’s wireless technology is built from intellectual property (IP) deployed in all mainstream application segments and meets the industry specifications. These technologies can be found in the modules through the various partners below, as well as associated various SOCs. Time to market can be accelerated using one of the many wireless products from Infineon Technologies below.

Resultados: 7
Seleccionar Imagen N.° de pieza Fabricante: Descripción Hoja de datos Disponibilidad Precio: (USD) Filtre los resultados en la tabla por precio unitario en función de su cantidad. Cantidad RoHS Modelo ECAD Serie Frecuencia Potencia de salida Tipo de interfaz Voltaje de alimentación - Mín. Voltaje de alimentación - Máx. Temperatura de trabajo mínima Temperatura de trabajo máxima Conector de tipo antena Dimensiones Protocolo: Bluetooth, BLE - 802.15.1 Protocolo: WiFi - 802.11 Empaquetado
Ezurio Módulos multiprotocolo RF Module, Chip Ant Sterling-LWB CYW4343W 913En existencias
Min.: 1
Mult.: 1

Sterling-LWB 2.4 GHz 14 dBm UART 1.8 V 3.6 V - 40 C + 85 C Chip 15.5 mm x 21 mm x 2 mm Bluetooth LE 802.11 b/g/n Cut Tape
Murata Electronics Módulos multiprotocolo Type 1FX Shielded ultra-small dual bandWi-Fi 11a/b/g/n/ac Bluetooth 8.2 167En existencias
Min.: 1
Mult.: 1
Carrete: 1,000

1FX 2.4 GHz 17 dBm SDIO 3.35 V 4.2 V - 30 C + 70 C External 6.95 mm x 5.15 mm x 1.1 mm 802.11 b/g/n Reel, Cut Tape
Ezurio Módulos multiprotocolo RF Module, U.FL Sterling-LWB CYW4343W 471En existencias
Min.: 1
Mult.: 1

Sterling-LWB 2.4 GHz 14 dBm UART 1.8 V 3.6 V - 40 C + 85 C u.FL 15.5 mm x 21 mm x 2 mm Bluetooth LE 802.11 b/g/n Cut Tape

Murata Electronics Módulos multiprotocolo Type 1GC Shielded ultra-small dual bandWi-Fi 11a/b/g/n/ac Bluetooth 9.2 477En existencias
Min.: 1
Mult.: 1
Carrete: 1,000

1GC 2.4 GHz, 5 GHz 12 dBm Ethernet, GPIO, I2C, SPI, UART, USB 3.13 V 3.63 V - 30 C + 85 C External 10 mm x 10 mm x 1.2 mm 802.11 a/b/g/n Reel, Cut Tape
Murata Electronics Módulos multiprotocolo Type 1DX Shielded ultra-small dual bandWi-Fi 11a/b/g/n/ac Bluetooth 4.1 13En existencias
1,000Se espera el 10/6/2026
Min.: 1
Mult.: 1
Carrete: 1,000

1DX 2.4 GHz 17 dBm SDIO, UART 1.71 V 3.63 V - 30 C + 70 C External 6.95 mm x 5.15 mm x 1.1 mm Bluetooth 4.1 802.11 b/g/n Reel, Cut Tape, MouseReel
Ezurio Módulos multiprotocolo RF Module, Sterling- LWB5, U.FL Plazo de entrega no en existencias 40 Semanas
Min.: 250
Mult.: 250

Sterling-LWB5 2.4 GHz, 5 GHz 16 dBm GPIO, SDIO/SPI, UART 3.2 V 4.3 V - 40 C + 85 C u.FL 15.5 mm x 21 mm x 2 mm Bluetooth 4.2 802.11 a/b/g/n/ac Cut Tape
Ezurio Módulos multiprotocolo RF Module, Sterling- LWB5, Chip Antenna Plazo de entrega no en existencias 40 Semanas
Min.: 250
Mult.: 250

Sterling-LWB5 2.4 GHz, 5 GHz 16 dBm GPIO, SDIO/SPI, UART 3.2 V 4.3 V - 40 C + 85 C Chip 15.5 mm x 21 mm x 2 mm Bluetooth 802.11 a/b/g/n/ac Cut Tape