Nuevos Computadora en un Módulo (COM)
DFRobot DFR1295 LattePanda Mu Ultra x86 Compute Module is a credit-card-sized, high-performance AI compute module designed for edge intelligence, robotics, and embedded computing applications. Powered by an Intel Core Ultra 7 Processor 256V, integrated Intel Arc 140V GPU, and Intel AI Boost NPU, the module delivers up to 115 TOPS of combined AI performance. This processing capability enables local execution of large language models, computer vision, speech processing, and machine learning workloads without requiring cloud connectivity.
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DFRobot DFR1295 LattePanda Mu Ultra x86 Compute ModuleAI compute module designed for edge intelligence, robotics, and embedded computing applications.10/5/2026
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Axiomtek CEM570 COM Express Type 6 ModulesBased on Intel® processor technology and designed for embedded computing applications.7/29/2026 -
Advantech SOM-6873 AMD Ryzen 8000 COM Express Type 6 ModuleDesigned for gaming applications and features a compact Type 6 pinout design.8/25/2025 -
Ka-Ro Electronics QSMP2 Solder-Down Computer On ModulesFeature up to 60x 3.3V general purpose I/O and LVDS display interface.3/21/2025 -
Advantech SOM-7533 COM Express® Mini Type10 ModulesBuilt with Intel® Core™ i3, N series, and Atom® x7000 Series Processors (Alder Lake-N/Amston Lake).1/30/2025 -
ADLINK Technology Nvidia RTX Embedded MXM ModulesFeatures NVIDIA embedded graphics powered by the Ampere architecture.6/6/2024 -
ADLINK Technology Nvidia Quadro T1000 Embedded MXM ModulesFeature NVIDIA embedded graphics built on the Turing™ architecture.6/3/2024 -
DFRobot Módulo informático Mu Micro x86 LattePandaCuenta con un procesador Intel N100 de cuatro núcleos, 8 GB de memoria LPDDR5 y 64 GB de almacenamiento.5/28/2024 -
Advantech ROM-2620 OSM 1.1 Computer-on-ModuleOSM 1.1 Computer-on-Module powered by the NXP i.MX 8ULP SoC.5/10/2024 -
NexAIoT ICES622X Computer-On-Module (COM)COM Express Type 6 compact-size module that features Intel® Atom™ X6000 processors.3/23/2024 -
NexAIoT SMC250 SMARC 2.1 Computer-On-Module (COM)Features an Intel Atom® x5-E3940 Quad Core processor in an 82mm x 50mm short-size module dimension.1/17/2024 -
Ka-Ro Electronics QFN Style Solder-Down Computer On ModuleSingle-sided, assembled in a small square size of 27mm and a height of 2.6mm.1/7/2024 -
Ka-Ro Electronics TXMP2 Computer On ModulePart of the TX family and includes an STM32MP255 processor with 1.5 GHz dual Arm® Cortex®-A35.1/7/2024 -
Ka-Ro Electronics TX91 Computer On ModuleComplete computer implemented on a board smaller than a credit card.1/7/2024 -
ADLINK Technology Express-RLP COM Express Basic Size Type 6 ModulesType 6 basic size modules based on the 13th Gen Intel® Core™ mobile processor.12/21/2023 -
NexAIoT ICES676S Computer-On-Module (COM)COM Express Type 6-pinouts basic module that supports 12/13th Generation Intel® Core™ processors.11/9/2023 -
ADLINK Technology Express-ADP Type 6 ModulePowered by the 12th Gen Intel® Core™ processor with an innovative hybrid architecture.8/23/2023 -
ADLINK Technology Express-ID7 ModuleBased on the Intel® Xeon® D-1700 processor with integrated high-speed Ethernet for up to 4x 10G.8/23/2023 -
Ka-Ro Electronics TX93 Computer-on-Module (COM)Features a 1.5GHz Dual ARM® Cortex®-A55 processor based on the NXP i.MX 93.7/20/2023 -
Ka-Ro Electronics QS93 QFN-Style Solder-Down Computer-on-Module100-pin QFN lead-styled module measures 27mm2 x 2.6mm in height and provides a single-sided assembly7/20/2023 -
congatec COMe-cAP6 COM Express® w/ Intel® Core™ ProcessorsBoasts the power of 12th Generation Intel Core Processors, supporting up to 64GByte LPDDR5 memory.4/1/2023 -
ADLINK Technology Express-TL COM Express Basic Size Type 6 ModulesBased on the 11th Gen Intel® Core™, Xeon® W, and Celeron® 6000 processors.2/2/2023 -
ADLINK Technology cExpress-TL COM Express Type 6 ModuleSupports PCI Express Gen 4 at 16GT/s and four USB 3.2 ports with transfer rates up to 10Gb/s.2/2/2023