Molex CP-6.5 Wire-to-Board Connector System

Molex CP-6.5 Wire-to-Board Connector System is a foolproof interconnect system that provides quick, easy identification of mated pairs in wire-to-board applications. The 6.50mm wire-to-board receptacles and PCB headers have color-coded housings to differentiate mating possibilities. Connectors with mismatched colors do not mate. Unique keying features within each header and receptacle housing prevent the entry of the receptacle into the header when mismated. A positive lock feature produces an audible click when fully mated.

Features

  • Wide spectrum of housing colors allows quick identification of mating combinations for assembly and repair
  • Polarization keys on the housing rib eliminate mismating and consequent electrical shorting of applications
  • Positive lock feature on housing produces an audible click when fully mated
  • Kinked solder tails provide added header-to-PCB retention during solder reflow
  • Absence of drain-holes in the PCB headers ensure compatibility with a conformal coating (potting)
  • Headers are +260°C wave-solder process capable and ideal for high-temperature assembly processing

Applications

  • Consumer
    • Air conditioners
    • Washing machines
    • Water heaters / boilers
  • Industrial Automation
    • HVAC controls
    • Industrial controllers
  • Industrial
    • Copiers
    • Security systems
    • Vending machines

Specifications

  • Electrical
    • 600VAC maximum voltage rating
    • 2A to 10A maximum current range
    • 10mΩ maximum low-level contact resistance
    • 1500VAC dielectric withstanding voltage
    • 1000MΩ minimum insulation resistance
  • Mechanical
    • 49.0N maximum insertion force or lock strength
    • 14.7N to 127.4N receptacle crimp pull-out force
    • 29.2N maximum terminal retention force
    • 30 cycle maximum durability
  • -40°C to +105°C operating temperature range
  • Materials
    • UL 94V-0, glass-filled, polyamide (PA) housing
    • Copper alloy contacts
    • Plating
      • Tin in the contact area
      • 1.27µ" matte tin over 1.27µ" nickel underplate in the solder tail area

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Publicado: 2015-07-07 | Actualizado: 2025-01-03