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Molex PCI Express Edgecard Connectors

Molex PCI Express Edgecard Connectors offer a third-generation I/O architecture. PCI-SIG revised the PCI Express specifications from version 1.1 to version 2.0. This revision doubles the PCI Express interconnect bit rate from 2.5GT/s (gigatransfer per second) to 5GT/s per lane. PCI Express supports high-bandwidth applications and is also backward compatible with PCI Express 1.1 version products.

Features

  • High-temperature thermoplastic housing
  • Keying design allows only 1x mating orientation
  • Complies with PCI-SIG industry specifications
  • Hot pluggable

Applications

  • Desktop computers and motherboards
  • Servers
  • Network interfaces

Specifications

  • 50VAC(RMS)/DC voltage rating
  • 1.1A current rating
  • 30mΩ maximum contact reistance
  • 500VAC dielectric withstand voltage
  • 1000MΩ minimum insulation resistance
  • 5N maximum terminal retention force
  • 1.15N maximum mating force per contact pair
  • 0.15N minimum unmating force per contact pair
  • 50-cycle durability
  • UL 94V-0-rated high-temperature nylon housing
  • Copper alloy contacts
  • Plating
    • 0.38µm or 0.76µm gold in the contact area
    • Tin in the solder area
    • Nickel underplating
  • -55°C to +85°C operating temperature range
Publicado: 2019-09-04 | Actualizado: 2024-09-16