STMicroelectronics CAM-56G3 Monochrome Promodules

STMicroelectronics CAM-56G3 Monochrome Promodules are sample camera modules made for seamless evaluation and integration of the VD56G3 1.5-megapixel monochrome image sensor. The ready-to-use vision extensions integrate a VD56G3 image sensor, lens holder, lens, and plug-and-play flex connection in a tiny format down to 6.5mm². The CAM-56G3 leverages the complete toolbox of on-chip features of the embedded VD56G3 image sensor, such as binning, autoexposure, or context management. Multiple GPIOs enable users to synchronize the modules with triggers and illumination. Featuring a MIPI CSI-2 output (single- or dual-phase), the promodules are ideally suited for embedded low-power setups.

The STMicroelectronics promodule references feature various lenses to match the needs of every application in terms of optical setup and mechanical constraints. All camera modules are equipped with the same FPC-to-board connector and pinout. The plug-and-play architecture allows users to change promodules instantly and reuse the same setup with different lenses, color options, and even different image sensors in the ST BrightSense portfolio.

CAM-56G3 promodules can be tested and integrated on computers or embedded processing boards using hardware and software tools from STMicroelectronics. The compatible EVK Main and P-Board hardware kits enable straight connection to a PC and embedded processing platforms respectively. Evaluation GUI software and Linux drivers are available for download.

Features

“Promodules” turnkey camera modules for evaluation:
- Including a VD56G3 image sensor, lens holder, lens, and plug-and-play flex connection
- Lens focused, glued, and tested in a cleanroom environment using specialized equipment
- Small footprint down to 6.5mm²
Various lens options
- Ultra-wide-angle lens for wide scene capture (152° DFOV)
- Highly compact lens for a thin module (84° DFOV)
- General purpose lens enabling various system setups (73° DFOV)

Plug-and-play connector to change the promodules at any time
- FPC-to-board 30-pin connector
- Same connector for all ST promodules
Ready for evaluation and integration
- On a computer with a USB output using the EVK Main hardware tool and the free Evaluation GUI software
- On embedded processing platforms with a MIPI CSI-2 output using the P-Board hardware tool and free Linux software tools
Promodules also available in color RGB versions (CAM-66GY)

Applications

Home and service robots
Smart appliances
AR/VR and gaming
Drones and UAVs
Industrial robots and AGVs

Quality inspection
3D stereo imaging
Barcode reading, logistics, and retail
Security and biometrics

Specifications

Image characteristics
- VD56G3 sensor
- 1.53MP resolution, 1124 x 1364
- 5:6 aspect ratio
- Global shutter type
- Monochrome color option
Electrical characteristics
- FPC-to-board connector type
- Hirose BM28 B0.6-30DP/2-0.35V connector reference
- 30-pins
- MIPI CSI-2 output interface, one- or two-lanes
- I²C control interface
- RAW8 and RAW10 output format
- 2.8V to 1.8V to 1.15V supply voltages
- 6MHz to 27MHz external clock frequency
Optical characteristics
- CAM-6G3-073CLR
  - F/2.2 aperture (f/#)
  - 73° D, 51° H, and 60° V field of view
  - 3.03mm EFL
  - 40cm -> ∞ depth of field
  - <1% TV distortion
- CAM-6G3-084CLR
  - F/2.0 aperture (f/#)
  - 84° D, 60° H, and 69° V field of view
  - 2.51mm EFL
  - 30cm -> ∞ depth of field
  - <1.5% TV distortion
- CAM-6G3-152CLR
  - F/2.0 aperture (f/#)
  - 152° D, 97° H, and 118° V field of view
  - 1.69mm EFL
  - 40cm -> ∞ depth of field
  - <27% TV distortion
- Clear filter

Mechanical characteristics
- CAM-6G3-073CLR
  - 6.5mm x 6.5mm x 4.68mm (LxWxH) module head dimensions
  - 12.4mm x 8.0mm x 4.68mm (LxWxH) module total dimensions
- CAM-6G3-084CLR
  - 6.5mm x 6.5mm x 3.98mm (LxWxH) module head dimensions
  - 12.4mm x 8.0mm x 3.98mm (LxWxH) module total dimensions
- CAM-6G3-152CLR
  - 9.0mm x 9.0mm x 7.15mm (LxWxH) module head dimensions
  - 13.65mm x 9.0mm x 7.15mm (LxWxH) module total dimensions
- 7.45mm distance from the connector to the optical center
Embedded
- Image quality optimization
  - Autoexposure
  - Automatic dark calibration
  - Defective pixel correction
  - Analog and digital gains
- Power and data optimization
  - Cropping
  - Binning
  - Subsampling
  - Context management with up to four contexts
- Mirror/flip
- Test pattern generation
- Temperature sensor
- 6x GPIOs